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In-house Production


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In-house Production

Our state-of-the-art manufacturing facilities are designed to produce high quality, high performance cell and panels that come ready to perform

Cell Process

  • Inspection

    Each wafer is thoroughly examined and measured to eliminate defects, so only the best-quality wafers are selected.

  • Wet Etching

    Selected wafers then undergo a wet etching process where the surfaces are immersed in acidic (multi) and alkaline (mono) solutions to help reduce light reflection.

  • Diffusion

    N-type emitters are formed by loading P-element POCI3 gas into P-type wafers.

  • Anti Reflective Coating

    The wafers are then coated with an anti-reflective (SiNx:H) film through a PECVD method which uses SiH4 and NH3 to reduce reflection and improve transmission.

  • Metallization

    Metallic electrodes are composed to gather activated electrical carriers (electrons and holes) for each cell.

  • Sorting

    Cells are finally measured and sorted by efficiency, as well as being classified by colour and electrical characteristics.

Module Process

  • Tabbing

    Each incoming wafer is checked again to eliminate any faults and defects.

  • Busing

    Cells are then welded with strings by busing ribbons to meet the required power output.

  • Lay Up

    Cells are assembled with layers of glass, EVA film and back sheet to protect them from external damage.

  • Lamination

    These layered modules are then encapsulated to protect the cells from water infiltration.

  • Framing

    Modules are installed with a junction box for electrical connection and framed to ensure mechanical strength.

  • Simulation

    Each module is tested under simulated conditions to check output performance and classified accordingly before completion.